Molded led package and method of making same

ABSTRACT

Packaged light emitting diodes (LEDs) and methods of packaging a LED include providing a first lead having a first recess in a bottom surface and a second lead having a second recess in a bottom surface, placing a LED die over a top surface of at least one of the first and the second leads, electrically connecting the LED die to the first lead and to the second lead, forming a package around the LED die that includes an opening in its upper surface exposing at least the LED die, and separating the package containing the LED die, the first lead and the second lead from a lead frame such that the package contains a first castellation and a second castellation in a side surface of the package, such that the castellations expose the leads and/or a first platable metal which is electrically connected to the leads.

RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application Nos.61/870,312, filed Aug. 27, 2013, 61/870,323, filed Aug. 27, 2013, and61/969,629, filed Mar. 24, 2014, the entire contents of all of which areincorporated herein by reference.

FIELD

The embodiments of the invention are directed generally to packagedlight emitting diode (LED) devices and methods of packaging LED devices.

BACKGROUND

Light emitting diodes (LEDs), such as nanowire LEDs, have a variety ofuses, including in electronic displays, such as liquid crystal displaysin laptops or LED televisions. In a typical LED packaging process, asemiconductor die containing one or more LEDs is mounted to a leadframe, and the die and lead frame are encased in a protective mold. Themold may include an open region aligned with the LED that enables lightto be emitted from the LED. Electrical connections to the LED packagemay be made via the lead frame. Further improvements in LED packagingwould be desirable.

SUMMARY

Various embodiments include methods of packaging a light emitting diode(LED) that include providing a lead frame comprising a first lead havinga first recess in a bottom surface and a second lead having a secondrecess in a bottom surface, placing a LED die over a top surface of atleast one of the first and the second leads, electrically connecting theLED die to the first lead and to the second lead, forming a packagearound the LED die, the first lead and the second lead, the packagehaving an opening in its upper surface exposing at least the LED die,and separating the package containing the LED die, the first lead andthe second lead from the lead frame such that the package contains afirst castellation and a second castellation in a side surface of thepackage, wherein the first castellation exposes at least one of thefirst lead and a first platable metal which is electrically connected tothe first lead, the second castellation exposes at least one of thesecond lead and a second platable metal which is electrically connectedto the second lead.

Further embodiments include methods of packaging a light emitting diode(LED) that include providing a lead frame comprising a first lead and asecond lead, placing a LED die over a top surface of at least one of thefirst and the second leads, electrically connecting the LED die to thefirst lead and to the second lead, forming a package around the LED die,the first lead and the second lead, the package having an opening in itsupper surface exposing at least the LED die, and separating the packagecontaining the LED die, the first lead and the second lead from the leadframe, wherein the lead frame contains a first alignment mark and thepackage contains a second alignment mark.

Further embodiments include methods of packaging light emitting diodes(LEDs) that include bonding a plurality of LED die over a plurality ofleads of a lead frame, electrically connecting each of the plurality ofLED die to a respective two of the plurality of leads, dipping the leadframe into a mold containing a moldable material, solidifying themoldable material to form a panel comprising a plurality of moldablematerial packages attached to the lead frame, wherein each of theplurality of packages is located around at least one of the plurality ofLED dies electrically connected to the respective two of the pluralityof leads, attaching a first set of the plurality of packages to a dicingtape, and singulating the first set of the plurality of packages fromthe panel.

Further embodiments include methods of testing a packaged light emittingdiode (LED) that include providing a package containing a LED die whichis electrically connected to a first lead and to a second lead locatedin the package, wherein the LED die is located over a top surface of atleast one of the first and the second leads, attaching a bottom surfaceof the package to dicing tape such that a first recess is located in abottom surface of the first lead exposed in the bottom surface of thepackage and a second recess is located in a bottom surface of the secondlead exposed in the bottom surface of the package, and testing the LEDdie by poking a testing pin or needle through the dicing tape into atleast one of the first recess and the second recess.

Various embodiments include packaged light emitting diode (LED) devicesthat include a first lead having a first recess in a bottom surface, asecond lead having a second recess in a bottom surface, a LED dielocated over a top surface of at least one of the first and the secondleads and electrically connected to the first lead and to the secondlead, and a package located around the LED die, the first lead and thesecond lead, wherein the package contains an opening in its uppersurface exposing at least the LED die, and the package contains a firstcastellation and a second castellation in a side surface of the package,the first castellation exposes at least one of the first lead and afirst platable metal which is electrically connected to the first lead,and the second castellation exposes at least one of the second lead anda second platable metal which is electrically connected to the secondlead.

Further embodiments include packaged light emitting diode (LED) devicesthat include a first lead having a first recess in a bottom surface, asecond lead having a second recess in a bottom surface, a LED dielocated over a top surface of at least one of the first and the secondleads and electrically connected to the first lead and to the secondlead, a package located around the LED die, the first lead and thesecond lead, and wherein a sidewall of the package has a non-uniformthickness and contains at least one structural strength enhancing regionof increased thickness.

Further embodiments include packaged light emitting diode (LED) devicesthat include a first lead having a first recess in a bottom surface, asecond lead having a second recess in a bottom surface, a LED dielocated over a top surface of at least one of the first and the secondleads and electrically connected to the first lead and to the secondlead, a package located around the LED die, the first lead and thesecond lead, and wherein sides and ends of the first and the secondleads are etched to increase a surface area of the first and the secondleads.

Further embodiments include a lead frame including a frame connected toa plurality of electrically conductive leads, wherein at least one ofthe plurality of leads comprises a floating finger lead which containsat least one free hanging, cantilevered end which is not attached to theframe.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated herein and constitutepart of this specification, illustrate example embodiments of theinvention, and together with the general description given above and thedetailed description given below, serve to explain the features of theinvention.

FIG. 1 is a schematic perspective illustration of a packaged LED deviceaccording to an embodiment.

FIG. 2A illustrates the packaged LED device mounted in a top-emittingconfiguration.

FIG. 2B illustrates the packaged LED device mounted in a side-emittingconfiguration.

FIG. 3A illustrates a packaged LED device according to one embodiment inwhich the package includes multiple LED dies and an interior wallseparating a first compartment containing the at least one first LED diefrom a second compartment containing at least one second LED die.

FIG. 3B illustrates a packaged LED device according to anotherembodiment in which a sidewall of the package has a non-uniformthickness and contains structural strength enhancing regions ofincreased thickness.

FIG. 3C illustrates a packaged LED device according to anotherembodiment in which the package includes multiple LED dies and aninterior wall separating a first compartment containing a green emittingLED die and a first encapsulant containing a green phosphor located overthe green emitting LED die from a second compartment containing a redemitting LED die and a blue emitting LED die and a second encapsulantwhich lacks the green phosphor located over the red emitting LED die andthe blue emitting LED die.

FIG. 3D illustrates a packaged LED device according to anotherembodiment in which the package includes multiple LED dies and twointerior walls defining three separate compartments, where eachcompartment contains at least one LED die.

FIG. 4A illustrates a portion of a lead frame according to oneembodiment in which the respective leads contain non-uniform recessesfor forming castellations having varying widths and sides and ends ofthe leads are etched to increase a surface area of the leads.

FIG. 4B illustrates a portion of a lead frame that includes floatingfinger leads which contain at least one free hanging, cantilevered endwhich is not attached to the frame.

FIGS. 5A-D illustrate a method of packaging an LED die with a pluralityof leads and a package according to one embodiment.

FIG. 6 illustrates a lead frame having a plurality of molded packagesattached thereto and having alignment marks to facilitate separation ofindividual LED packages.

FIG. 7 schematically illustrates a method of testing an LED packageusing a testing pin according to one embodiment.

DETAILED DESCRIPTION

The various embodiments will be described with reference to theaccompanying drawings. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.References made to particular examples and implementations are forillustrative purposes, and are not intended to limit the scope of theinvention or the claims.

Embodiments of the invention include packaged LED devices and methods ofpackaging an LED. In various embodiments, a package and lead designincludes features that enable the packaged LED device to be mounted aseither a top-emitting or a side-emitting LED package.

FIG. 1 is a schematic perspective illustration of a packaged LED device100 according to one embodiment. The packaged LED device 100 includes aplurality of leads, including a first lead 101 and a second lead 103.Each lead 101, 103 may be formed of an electrically conductive material(e.g., a metal, such as copper). The leads 101, 103 may be formed aspart of a lead frame and separated from the frame to produce individualpackaged LED devices 100, as described below. The leads 101, 103 mayextend generally parallel without contacting one another between a firstside surface 108 and a second side surface 109 of the device 100.

At least one LED die 105 (e.g., chip) may be mounted on a first surface102 of lead 101. The LED die 105 may include one or more light-emittingsemiconductor elements on a supporting substrate. Any suitable LEDstructure may be utilized. In embodiments, the LED may be ananowire-based LED. Nanowire LEDs are typically based on one or more pn-or pin-junctions. Each nanowire may comprise a first conductivity type(e.g., doped n-type) nanowire core and an enclosing second conductivitytype (e.g., doped p-type) shell for forming a pn or pin junction that inoperation provides an active region for light generation. Anintermediate active region between the core and shell may comprise asingle intrinsic or lightly doped (e.g., doping level below 10¹⁶ cm⁻³)semiconductor layer or one or more quantum wells, such as 3-10 quantumwells comprising a plurality of semiconductor layers of different bandgaps. Nanowires are typically arranged in arrays comprising hundreds,thousands, tens of thousands, or more, of nanowires side by side on thesupporting substrate to form the LED structure. The nanowires maycomprise a variety of semiconductor materials, such as III-Vsemiconductors and/or III-nitride semiconductors, and suitable materialsinclude, without limitation GaAs, InAs, Ge, ZnO, InN, GaInN, GaN,AlGaInN, BN, InP, InAsP, GaInP, InGaP:Si, InGaP:Zn, GaInAs, AlInP,GaAlInP, GaAlInAsP, GaInSb, InSb, AN, GaP and Si. The supportingsubstrate may include, without limitation, III-V or II-VIsemiconductors, Si, Ge, Al₃O₃, SiC, Quartz and glass. Further detailsregarding nanowire LEDs and methods of fabrication are discussed, forexample, in U.S. Pat. Nos. 7,396,696, 7,335,908 and 7,829,443, PCTPublication Nos. WO2010014032, WO2008048704 and WO2007102781, and inSwedish patent application SE 1050700-2, all of which are incorporatedby reference in their entirety herein. Alternatively, bulk (i.e., planarlayer type) LEDs may be used instead of or in addition to the nanowireLEDs.

The LED die 105 may be mounted to the first surface 102 of the lead 101using any suitable bonding technique. In embodiments, the surface of theLED die 105 may be electrically insulated from the lead 101 via aninsulating material (e.g., a sapphire layer), which may be or may formpart of the support substrate of the die 105. The active region of theLED die 105 may be electrically connected to the first lead 101 by afirst wire 119, which may be bonded to a first bond pad region of thedie 105. A second wire 121 may be bonded to a second bond pad region ofthe die 105 to electrically connect the die 105 to the second lead 103.

The packaged LED device 100 also includes a package 107, which may be aprotective mold around the die 105 and leads 101, 103. For clarity, thepackage 107 is shown as transparent in FIG. 1. In embodiments, thepackage 107 may be a molded epoxy material, although other materials(e.g., ceramic, plastic, glass, etc.) may be utilized. The leads 101,103 may be at least partially embedded in the package 107. As shown inFIG. 1, the package 107 may form the sidewalls and at least a portion ofthe bottom surface of the device 100 and may include an opening 111 inits upper surface exposing at least the LED die 105. In someembodiments, the opening 111 may be filled with an encapsulant material(not shown) that is optically transmissive over at least a selectedwavelength range. The encapsulant may comprise a phosphor or dyematerial.

The leads 101, 103 may each include a recessed portion 112, 114 on abottom surface of the respective leads 101, 103 (i.e., on the surfaceopposite the LED die 105). The package 107 may include a firstcastellation 113 and a second castellation 115 in a side surface 110 ofthe package 107. The first castellation 113 exposes an edge of the firstlead 101 including the recessed portion 112. The second castellation 115exposes an edge of the second lead 103 including the recessed portion114. Each of the recessed portions 112, 114 may include a fillermaterial 117, which may be a platable metal formed over the recessedportions 112, 114. Thus, in an embodiment, the first castellation 113exposes an edge of the first lead 101 and platable metal 117, and thesecond castellation 115 exposes an edge of the second lead 103 and theplatable metal 117.

In the embodiment of FIG. 1, the leads 101, 103 have non-uniformdimensions along their length between the first end 108 and the secondend 109 of the device 100. As shown in FIG. 1, the cross-sectionaldimensions of the leads 101, 103 are identical proximate the first end108, including in the portions containing the respective recessedportions 112, 114, but are different proximate to the second end 108 ofthe device. The first lead 101 has an “L” shape in which the width ofthe lead 101 increases to accommodate the LED die 105. The second lead103 is widest proximate to the first end 108, and narrows proximate tothe second end 109. Various other configurations are possible, includingwhere the leads 101, 103 have identical shapes along their entirelengths. Preferably, the LED die 105 is bonded to only to the topsurface 102 of a rear portion of the first lead 101, the first recess112 is located in the bottom surface in a front portion of the firstlead 101 which is different from the rear portion of the first lead, andthe second recess 114 is located in the bottom surface in a frontportion of the second lead 103 which is wider than rear portion of thesecond lead.

The packaged LED device 100 may be mounted to a support surface 200 ineither a top-emitting or a side-emitting configuration, as shown inFIGS. 2A-B. FIG. 2A shows the device 100 in a top-emittingconfiguration, with the predominant direction of light emission from theLED indicated by the vertical arrow. At least a portion of the leads101, 103, including at least the recessed portions 112, 114, may beexposed on the bottom surface of the package 107. Electrical contacts201 located over the support surface 200 may contact the exposedportions of the respective leads 101, 103 to connect the leads 101, 103and the LED die 105 to an external current/voltage source. Inembodiments, the electrical contacts 201 may be bonded to the leads 101,103, such as via soldering. In some embodiments, the electrical contacts201 may be soldered to the optional filler material 117 that may belocated within the recessed portions 112, 114 of the leads 101, 103.

FIG. 2B shows the device 100 in a side-emitting configuration, in whichthe side surface 110 of the package 107 containing the castellations113, 115 (see FIG. 1) faces the support structure 200 and thepredominant direction of light emission (as indicated by the arrow) isparallel to the support surface 200. In this configuration, theelectrical contacts 201 on the support structure 200 (not visible inthis view) contact the first and second leads 101, 103 through the firstand second castellations 113, 115, respectively. As in the embodiment ofFIG. 2A, the electrical contacts 201 may be bonded (e.g., soldered) tothe leads, either directly or indirectly through the optional fillermaterial. The side-emitting configuration of FIG. 2B may provideimproved coupling of light into a waveguide.

The embodiment of FIG. 1 illustrates a package for a single LED die. Inother embodiments, multiple LED dies may be included within a package.FIG. 3A illustrates an embodiment of a packaged LED device 300 in whichthe package 307 includes multiple LED dies 305 a, 305 b, 305 c and aninterior wall 313 separating a first compartment 311 containing LED dies305 a, 305 b from a second compartment 312 containing LED die 305 c.Each of the LED dies 305 a, 305 b, 305 c may be configured to emit lightat different wavelengths (e.g., green, blue and red visible light). Thepackaged LED device 300 may include a plurality of leads 320, 321, 322,323, 324, 325, each having a recessed portion as described above inconnection with FIG. 1. Each of the dies 305 a, 305 b, 305 c may bemounted on a top surface of a lead and electrically connected to atleast two different leads, as described above. The package 307 mayinclude castellations 330, 331, 332, 333, 334, 335, 336 on a sidesurface 310 of the package 307 that expose the edges of the leads 320,321, 322, 323, 324, 325 at their respective recessed portions.

In one embodiment, the interior wall 313 may separate the secondcompartment 312 containing a red-emitting LED die 305 c from the firstcompartment 311 containing a green-emitting LED die 305 a and ablue-emitting LED die 305 b. The second compartment 312 may contain afirst encapsulant (not shown) containing a red emitting phosphor locatedover the red LED die 305 c, and the first compartment 311 may contain asecond encapsulant (not shown) which lacks the red emitting phosphorlocated over the green-emitting LED die 305 a and the blue-emitting LEDdie 305 b. Each die may contain nanowire and/or bulk LEDs. For example,the green emitting die 305 a may comprise nanowire LEDs, the redemitting die 305 c may comprise bulk LEDs, and the blue emitting die 305b may comprise either nanowire or bulk LEDs.

FIG. 3B illustrates an alternative embodiment of the packaged LED device300 in which the package 307 includes a variable wall thickness and aninternal radius to add wall thickness in select areas and thus increasethe package structural strength, such as a structural strength enhancingregion 314 of increased thickness in a sidewall of the package. FIG. 3Balso illustrates castellations 330, 331, 332, 333, 334, 335 and leads320, 321, 322, 323, 324, 325 having varying dimensions (e.g., atcastellation 330 and lead 320 are wider than the other castellations andleads in the device 300).

FIG. 3C illustrates another embodiment of a packaged LED device 300. Thedevice 300 may be similar to the device of FIG. 3A, but in thisembodiment, the second compartment 312 separated by the interior wall313 contains a green-emitting LED die 305 a, and the first compartment311 contains a blue-emitting LED die 305 b and a red-emitting LED die305 c. The second compartment 312 may contain a first encapsulant (notshown) containing a green-emitting phosphor located over thegreen-emitting LED die 305 a, and the first compartment 311 may containa second encapsulant (not shown) which lacks the green emitting phosphorover the blue-emitting LED die 305 a and the red-emitting LED die 305 c.Each die may contain nanowire and/or bulk LEDs. In addition, the LEDdevice 300 of FIG. 3C may include a variable wall thickness and internalradius to enhance structural strength and/or castellations 330, 331,332, 333, 334, 335 having varying dimensions such as shown in FIG. 3B.

FIG. 3D illustrates yet another embodiment of a packaged LED device. Thedevice 300 may be similar to the devices shown in FIGS. 3A and 3C, butmay include two interior walls 313 a, 313 b that separate the device 300into three compartments 311, 312, 340. Each compartment 311, 312, 340may contain at least one LED die 305 a, 305 b, 305 c. For example,compartment 340 may contain a first one of a blue-emitting LED die 305b, a green-emitting LED die 305 a, and a red-emitting LED die 305 c(e.g., compartment 340 contains a blue-emitting LED die 305 b in FIG.3D), compartment 311 may contain a second one of the blue-emitting LEDdie 305 b, the green-emitting LED die 305 a and the red-emitting LED die305 c (e.g., compartment 311 contains a green-emitting LED die 305 a inFIG. 3D), and compartment 312 may contain a third one of theblue-emitting LED die 305 b, the green-emitting LED die 305 a and thered-emitting LED die 305 c (e.g., compartment 312 contains ared-emitting LED die 305 c in FIG. 3D).

Each compartment 311, 312, 340 may contain an encapsulant (not shown)over the respective LED dies 305 a, 305 b, 305 c. The encapsulant ineach compartment 311, 312, 340 may be the same as or different than theencapsulant in the other compartments. In one embodiment, compartment312 may contain a first encapsulant (not shown) containing a redemitting phosphor located over the red LED die 305 c, compartment 311may contain a second encapsulant (not shown) which lacks the redemitting phosphor located over the green-emitting LED die 305 a, andcompartment 340 may contain a third encapsulant (not shown) which lacksthe red emitting phosphor located over the blue-emitting LED die 305 b.The second encapsulant and the third encapsulant may be the samematerial or different materials.

In another embodiment, compartment 311 may contain a first encapsulant(not shown) containing a green emitting phosphor located over the greenLED die 305 a, compartment 312 may contain a second encapsulant (notshown) which lacks the green-emitting phosphor located over thered-emitting LED die 305 c, and compartment 340 may contain a thirdencapsulant (not shown) which lacks the green-emitting phosphor locatedover the blue-emitting LED die 305 b. The second encapsulant and thethird encapsulant may be the same material or different materials inthis embodiment.

In yet another embodiment, compartment 311 may contain a firstencapsulant (not shown) containing a green emitting phosphor locatedover the green LED die 305 a, compartment 312 may contain a secondencapsulant (not shown) containing a red emitting phosphor located overthe red LED die 305 c, and compartment 340 may contain a thirdencapsulant (not shown) which lacks the green-emitting phosphor and thered-emitting phosphor located over the blue-emitting LED die 305 b.

Each die in the respective compartments 311, 312, 340 may containnanowire and/or bulk LEDs. Further, a packaged LED device 300 mayinclude additional interior walls that separate the device into morethan three compartments. In addition, the LED device 300 of FIG. 3D mayinclude a variable wall thickness and internal radius to enhancestructural strength and/or castellations 330, 331, 332, 333, 334, 335having varying dimensions such as shown in FIG. 3B.

FIG. 4A is a schematic top (overhead) view of a lead frame 400 having aplurality of leads 401, 402, 403, 404, 405, 406 used for producing apackaged LED device, such as device 300. The lead frame 400 may beformed, for example, by patterning (e.g., etching) a copper sheet orplate to form the frame 400 and leads 401, 402, 403, 404, 405, 406 in adesired shape. Pits (i.e., recesses) 411, 412, 413, 414, 415, 416 may beformed in a surface of the leads 401, 402, 403, 404, 405, 406 to providethe recessed portions. The sides 408 and ends 409 of the leads 401, 402,403, 404, 405, 406 may be etched to increase a surface area for thepackage material (e.g. epoxy) to mate with and thus improve the adhesionof the leads to the package. The leads may be removed from the frame 400to produce a packaged LED device, as described further below.

FIG. 4B illustrates an alternative embodiment of a lead frame 400 havingone or more “floating finger” leads 440 (i.e. a protrusion or fingerthat is not supported at both ends. e.g., which contains at least onefree hanging, cantilevered end which is not attached to the frame). Thefloating finger lead frame may be made significantly wider to supportit. The floating fingers allow for independent electrical connectionsinside the package after the leads are singulated (i.e., removed fromthe frame 400).

FIGS. 5A-D illustrate a method of packaging an LED die according to oneembodiment. The method may include forming pits (i.e., recesses) 501,503 in the back side of the respective leads 101, 103 of a lead frame,as shown in FIG. 5A. The leads frame having leads or “fingers” may be asshown in FIGS. 4A-B, for example. The leads 101, 103 are illustrated asrectangles for simplicity in FIG. 5A-D, although other shapes may beused. In addition, the frame that connects the leads 101, 103 is notillustrated for clarity.

A metal filler 117 (e.g., a solderable metallization stack up) may beformed in the pits 501, 503, as shown in FIG. 5B. An LED die 105 may bebonded to the top surface of one or both leads 101, 103, as shown inFIG. 5C. The LED die 105 may be electrically connected to the leads 101,103 by wires. The leads 101, 103 and LED die 105 may then beencapsulated by a package 107, which may be an epoxy material. Thepackage 107 includes an opening 111 in its upper surface exposing atleast the LED die 105.

In embodiments, the package 107 may be formed by dipping a lead framecontaining the leads 101, 103 and LED die(s) 105 into a mold containingan epoxy and solidifying the epoxy to form the package attached to thelead frame. Alternatively, the die 105 may be attached to the leads 101,103 after the formation of the package 107 on the leads 101, 103. Thus,the LED die 105 may be electrically connected to the first lead and tothe second lead by wire bonding the LED die to the first lead and to thesecond lead before or after the step of forming the package. A pluralityof packages 107, each encapsulating a plurality of lead frame leads andone or more LED dies, may be formed over a lead frame 400 to form apanel 600 of packaged LEDs, as shown in FIG. 6. In embodiments, themolded panel 600 may have alignment marks (e.g., dicing lines) moldedinto the surface of the epoxy package walls. Similar marks, such asetched lines or slots, may be included in the lead frame 400. Thesefeatures may facilitate inspection to check that the molded epoxy panelis aligned to the lead frame within specified tolerances. In addition,the alignment marks may aid a dicing operator in aligning a dicing sawblade to the panel and for quality assurance to check after dicing thatthe diced package walls are within tolerance. Thus, the singulation stepmay optionally include checking that a first alignment mark on the leadframe and a second alignment mark on the package (or on the panel) arewithin a predetermined tolerance, and aligning a dicing saw blade withthe first alignment mark and the second alignment mark before dicing thepackage from the lead frame.

FIG. 5C illustrates a dicing line 507 in the epoxy package 107. Thedicing line 507 may be aligned over the pits 501, 503 in the respectiveleads 101, 103 of the lead frame. The package 107 containing the LED die105, the first lead 101 and the second lead 103 may then be separatedfrom the lead frame, as shown in FIG. 5C. Separating the package 107from the lead frame may include dicing or snapping the package along thedicing line 507 and through the pits 501, 503 to expose a firstcastellation 113 and a second castellation 115 in the side surface ofthe package 107. Dicing or otherwise separating the package 107 throughthe pits 501, 503 exposes the recessed portions 112, 114 of the leads101, 103, as well as the filler material (e.g., solderable metal) whichpartially fills the pits.

In embodiments, a dicing tape 700 may be bonded to the bottom surface ofthe package 107, prior to separating the package 107 from the lead frame(i.e., singulation), as shown in FIG. 7. The LED die 105 may be testedby poking a testing pin 701 or needle through the dicing tape 700 in thearea of the pits 501, 503. The pits 501, 503 allow the tape 700 tostretch and the pin 701 to break through the tape to contact the leads101, 103. The pin 701 may form a temporary electrical connection withthe LED device to enable testing. This action of punching through tapeinstead of crushing or pinching has the added advantage that the probetip is wiped clean and thus avoids clogging of the probe needle.

The foregoing method descriptions are provided merely as illustrativeexamples and are not intended to require or imply that the steps of thevarious embodiments must be performed in the order presented. As will beappreciated by one of skill in the art the order of steps in theforegoing embodiments may be performed in any order. Words such as“thereafter,” “then,” “next,” etc. are not necessarily intended to limitthe order of the steps; these words may be used to guide the readerthrough the description of the methods. Further, any reference to claimelements in the singular, for example, using the articles “a,” “an” or“the” is not to be construed as limiting the element to the singular.

Although the foregoing refers to particular preferred embodiments, itwill be understood that the invention is not so limited. It will occurto those of ordinary skill in the art that various modifications may bemade to the disclosed embodiments and that such modifications areintended to be within the scope of the invention. All of thepublications, patent applications and patents cited herein areincorporated herein by reference in their entirety.

What is claimed is:
 1. A method of packaging a light emitting diode(LED), comprising: providing a lead frame comprising a first lead havinga first recess in a bottom surface and a second lead having a secondrecess in a bottom surface; placing a LED die over a top surface of atleast one of the first and the second leads; electrically connecting theLED die to the first lead and to the second lead; forming a packagearound the LED die, the first lead and the second lead, the packagehaving an opening in its upper surface exposing at least the LED die;and separating the package containing the LED die, the first lead andthe second lead from the lead frame such that the package contains afirst castellation and a second castellation in a side surface of thepackage; wherein: (i) the first castellation exposes at least one of thefirst lead and a first platable metal which is electrically connected tothe first lead; (ii) the second castellation exposes at least one of thesecond lead and a second platable metal which is electrically connectedto the second lead; (iii) the LED die comprises at least one greenemitting LED die; (iv) the package further comprises: a third lead, afourth lead, a fifth lead and a sixth lead; a third castellation in theside surface of the package, wherein the third castellation exposes atleast one of the third lead and a third platable metal which iselectrically connected to the third lead; a fourth castellation in theside surface of the package, wherein the fourth castellation exposes atleast one of the fourth lead and a fourth platable metal which iselectrically connected to the fourth lead; a fifth castellation in theside surface of the package, wherein the fifth castellation exposes atleast one of the fifth lead and a fifth platable metal which iselectrically connected to the fifth lead; a sixth castellation in theside surface of the package, wherein the sixth castellation exposes atleast one of the sixth lead and a sixth platable metal which iselectrically connected to the sixth lead; at least one blue emitting LEDdie which is electrically connected to the third lead and to the fourthlead; and at least one red emitting LED die which is electricallyconnected to the fifth lead and to the sixth lead; (v) the packagecomprises an interior wall separating a first compartment containing theat least one green emitting LED die from a second compartment containingthe at least one red emitting LED die and the at least one blue LED die;(vi) the first compartment contains a first encapsulant containing agreen emitting phosphor located over the at least one green emitting LEDdie; and (vii) the second compartment contains a second encapsulantwhich lacks the green emitting phosphor located over the at least onered emitting LED die and the at least one blue emitting LED die.
 2. Amethod of packaging a light emitting diode (LED), comprising: providinga lead frame comprising a first lead having a first recess in a bottomsurface and a second lead having a second recess in a bottom surface;placing a LED die over a top surface of at least one of the first andthe second leads; electrically connecting the LED die to the first leadand to the second lead; forming a package around the LED die, the firstlead and the second lead, the package having an opening in its uppersurface exposing at least the LED die; and separating the packagecontaining the LED die, the first lead and the second lead from the leadframe such that the package contains a first castellation and a secondcastellation in a side surface of the package; wherein: (i) the firstcastellation exposes at least one of the first lead and a first platablemetal which is electrically connected to the first lead; (ii) the secondcastellation exposes at least one of the second lead and a secondplatable metal which is electrically connected to the second lead; (iii)the LED die comprises at least one green emitting LED die; (iv) thepackage further comprises: a third lead, a fourth lead, a fifth lead anda sixth lead; a third castellation in the side surface of the package,wherein the third castellation exposes at least one of the third leadand a third platable metal which is electrically connected to the thirdlead; a fourth castellation in the side surface of the package, whereinthe fourth castellation exposes at least one of the fourth lead and afourth platable metal which is electrically connected to the fourthlead; a fifth castellation in the side surface of the package, whereinthe fifth castellation exposes at least one of the fifth lead and afifth platable metal which is electrically connected to the fifth lead;a sixth castellation in the side surface of the package, wherein thesixth castellation exposes at least one of the sixth lead and a sixthplatable metal which is electrically connected to the sixth lead; atleast one blue emitting LED die which is electrically connected to thethird lead and to the fourth lead; and at least one red emitting LED diewhich is electrically connected to the fifth lead and to the sixth lead;and (v) the package comprises at least two interior walls defining atleast three separate compartments, wherein the at least one greenemitting LED die is located in a first compartment, the at least one redemitting LED die is located in a second compartment and the at least oneblue emitting LED die is located in a third compartment.
 3. The methodof claim 2, wherein: the first compartment contains a first encapsulantcontaining a green emitting phosphor located over the at least one greenemitting LED die; the second compartment contains a second encapsulantwhich lacks the green emitting phosphor located over the at least onered emitting LED die; and the third compartment contains a thirdencapsulant which lacks the green emitting phosphor located over the atleast one blue emitting LED die.
 4. The method of claim 3, wherein thesecond encapsulant and the third encapsulant comprise the same material.5. The method of claim 3, wherein the second encapsulant contains a redemitting phosphor, and the third encapsulant lacks the green emittingphosphor and the red emitting phosphor.
 6. The method of claim 2,wherein: the second compartment contains a second encapsulant containinga red emitting phosphor located over the at least one red emitting LEDdie; and the first compartment and the third compartment contain a firstand third encapsulant, respectively, where the first and the thirdencapsulant lack the red emitting phosphor.
 7. A packaged light emittingdiode (LED) device, comprising: a first lead having a first recess in abottom surface; a second lead having a second recess in a bottomsurface; a LED die located over a top surface of at least one of thefirst and the second leads and electrically connected to the first leadand to the second lead; and a package located around the LED die, thefirst lead and the second lead; wherein: (i) the package contains anopening in its upper surface exposing at least the LED die; (ii) thepackage contains a first castellation and a second castellation in aside surface of the package; (iii) the first castellation exposes atleast one of the first lead and a first platable metal which iselectrically connected to the first lead; (iv) the second castellationexposes at least one of the second lead and a second platable metalwhich is electrically connected to the second lead; (v) the packagefurther comprises: a third lead, a fourth lead, a fifth lead and a sixthlead; a third castellation in the side surface of the package, whereinthe third castellation exposes at least one of the third lead and athird platable metal which is electrically connected to the third lead;a fourth castellation in the side surface of the package, wherein thefourth castellation exposes at least one of the fourth lead and a fourthplatable metal which is electrically connected to the fourth lead; afifth castellation in the side surface of the package, wherein the fifthcastellation exposes at least one of the fifth lead and a fifth platablemetal which is electrically connected to the fifth lead; a sixthcastellation in the side surface of the package, wherein the sixthcastellation exposes at least one of the sixth lead and a sixth platablemetal which is electrically connected to the sixth lead; at least oneblue emitting LED die which is electrically connected to the third leadand to the fourth lead; and at least one red emitting LED die which iselectrically connected to the fifth lead and to the sixth lead; (vi) thepackage comprises an interior wall separating a first compartmentcontaining the at least one green emitting LED die from a secondcompartment containing the at least one red emitting LED die and the atleast one blue LED die; (vii) the first compartment contains a firstencapsulant containing a green emitting phosphor located over the atleast one green emitting LED die; and (viii) the second compartmentcontains a second encapsulant which lacks the green emitting phosphorlocated over the at least one red emitting LED die and the at least oneblue emitting LED die.
 8. A packaged light emitting diode (LED) device,comprising: a first lead having a first recess in a bottom surface; asecond lead having a second recess in a bottom surface; a LED dielocated over a top surface of at least one of the first and the secondleads and electrically connected to the first lead and to the secondlead; and a package located around the LED die, the first lead and thesecond lead; wherein: (i) the package contains an opening in its uppersurface exposing at least the LED die; (ii) the package contains a firstcastellation and a second castellation in a side surface of the package;(iii) the first castellation exposes at least one of the first lead anda first platable metal which is electrically connected to the firstlead; (iv) the second castellation exposes at least one of the secondlead and a second platable metal which is electrically connected to thesecond lead; (v) the package further comprises: a third lead, a fourthlead, a fifth lead and a sixth lead; a third castellation in the sidesurface of the package, wherein the third castellation exposes at leastone of the third lead and a third platable metal which is electricallyconnected to the third lead; a fourth castellation in the side surfaceof the package, wherein the fourth castellation exposes at least one ofthe fourth lead and a fourth platable metal which is electricallyconnected to the fourth lead; a fifth castellation in the side surfaceof the package, wherein the fifth castellation exposes at least one ofthe fifth lead and a fifth platable metal which is electricallyconnected to the fifth lead; a sixth castellation in the side surface ofthe package, wherein the sixth castellation exposes at least one of thesixth lead and a sixth platable metal which is electrically connected tothe sixth lead; at least one blue emitting LED die which is electricallyconnected to the third lead and to the fourth lead; and at least one redemitting LED die which is electrically connected to the fifth lead andto the sixth lead; and (vi) the package comprises at least two interiorwalls defining at least three separate compartments, wherein the atleast one green emitting LED die is located in a first compartment, theat least one red emitting LED die is located in a second compartment andthe at least one blue emitting LED die is located in a thirdcompartment.
 9. The device of claim 8, wherein: the first compartmentcontains a first encapsulant containing a green emitting phosphorlocated over the at least one green emitting LED die; the secondcompartment contains a second encapsulant which lacks the green emittingphosphor located over the at least one red emitting LED die; and thethird compartment contains a third encapsulant which lacks the greenemitting phosphor located over the at least one blue emitting LED die.10. The device of claim 9, wherein the second encapsulant and the thirdencapsulant comprise the same material.
 11. The device of claim 9,wherein the second encapsulant contains a red emitting phosphor, and thethird encapsulant lacks the green emitting phosphor and the red emittingphosphor.
 12. The device of claim 8, wherein: the second compartmentcontains a second encapsulant containing a red emitting phosphor locatedover the at least one red emitting LED die; and the first compartmentand the third compartment contain a first and third encapsulant,respectively, where the first and the third encapsulant lack the redemitting phosphor.